How to make PCB substrate with high thermal conductivity
Thermal performance has been a major concern for PCB design and manufacturing engineers as well as PCB substrate materials with high thermal conductivity, playing an important role in improving the thermal performance of PCBs. Based on this basic principle, this article mainly introduces the manufacturing method of PCB substrate material with high thermal conductivity. Experiments show that the adiabatic performance is reliable, and the thermal conductivity reaches more than 3w / m · k.
The main idea of this method
This method of manufacturing a PCB substrate material with high thermal conductivity relies on the alternate stacking of prepregs with multiple voids prior to copper foil coating and resin films with high thermal conductivity. During heating of the stack, voids in the prepreg are filled with a resin composite material having a high thermal conductivity to become strong to obtain a PCB substrate material having excellent thermal and dielectric properties and a high thermal conductivity while maintaining the mechanical strength of the substrate .